FOG/OLB Main-press Bonding M/C-FOG/OLB Bonding Machine-

FOG/OLB Main-press Bonding M/C

Model: LOA32-X1
Use of equipment: This machine is used for kinds of FPC, COF, TAB and Liquid crystal screen PANEL (LCD PANEL), touch screen (TOUCH, PANEL), electronic ink display (EPD PANEL) and PCB multi-stations assembly.
Widely used in large and medium-size LCD screen (LCD PANEL), touch screen(TOUCH PANEL), electronic ink display(EPD PANEL) for production and maintenance process( such as FOG, FOB, OLB, PWB bonding process ).

Sales Hotline：13410000400Send mail

Product Details
Product Parameters
Process Flow/Tools

FOG OLB邦定设备.jpg

◆Turn on the machine and set the corresponding parameters.

◆The corresponding parameters are set up, the panel platform moves to receiving position. Then panel is placed to the loading platform.The positions is fixed, CCD assists alignment.

◆The alignment is fixed , press vacuum button, the panel is attached, Y axis position block goes down, then press double buttons, platform moves to bonding position.

◆Bonding head goes down and bonding time is up, then bonding is completed. Then Z axis of bonding head motor rises.

◆Manually download, repeat above actions.