FOB Bonding M/C
  • Model: XCH70-A6
  • Use of equipment: The machine is used for bonding FPC, COF, TAB on PCB.

Sales Hotline:Send mail

  • Product Details
  • Product Parameters
  • Process Flow/Tools

    XCH70-A6 主图.jpg

    ◆ Put panel on platform and turn on vacuum to attach it, platform rise.

    ◆ Put PCB on aligning platform, press double “start” button, platform goes down.

    ◆ Manual adjust X-Y-θ adjuster of PCB pallet to align, press double “start” button to bond. 

    XCH70-A6 FOB绑定设备.png

    XCH70-A6 FOB绑定设备.png

    XCH70-A6 FOB绑定设备.png