FOG/FOBbonding m/c
  • Model: XCH77-A6
  • Use of equipment: This machine is used for all kinds of FPC, COF, TAB and Liquid crystal screen PANEL (LCD PANEL), touch screen (TOUCH, PANEL), electronic ink display (EPD PANEL) and PCB multi stations assembly.
    Widely used in large and medium-sized LCD screen (LCD PANEL), touch screen(TOUCH PANEL), electronic ink display(EPD PANEL) for production and maintenance process( such as FOG, FOB, OLB, PWB bonding process ).

Sales Hotline:13410000400Send mail

  • Product Details
  • Product Parameters
  • Process Flow/Tools

    XCH77-A6.jpg

    ◆Start and reset machine, the machine go back to origin.

    Enter auto mode.

    Put panel onto platform and positioned by locating parts. Turn on vacuum to attach panel, X locating part goes down.

    Press double start button, panel moves to aligning area.

    Put FPC, COF, PCB onto fixture, press vacuum button to attach it, panel platform down to bonding position.

    Adjust fixture manually to align with panel, aligning finished.

    Press double start button, platform moves to bonding position, pressure head goes down to bond.

    Bonding finished, platform moves to next bonding position (can set multi-station bonding), platform moves to discharge area.

    XCH77-A6邦定设备.png


    XCH77-A6邦定设备.png

    XCH77-A6邦定设备.png