FOB/FOB bonding M/C
  • Model: XCH91-B5
  • Use of equipment: This machine is used for all kinds of FPC, COF, TAB and Liquid crystal screen PANEL (LCD PANEL), touch screen (TOUCH, PANEL), electronic ink display (EPD PANEL) and PCB multi stations assembly.
    Widely used in large and medium-sized LCD screen (LCD PANEL), touch screen(TOUCH PANEL), electronic ink display(EPD PANEL) for production and maintenance process( such as FOG, FOB, OLB, PWB bonding process )

Sales Hotline:13410000400Send mail

  • Product Details
  • Product Parameters
  • Process Flow/Tools

    XCH91-B5 主图.jpg

    ◆After the power  is on, platform automatically go back to origin. Then left platform is moved to the middle of the device, and the product pre alignment.

    ◆Place the PANEL on the working platform, open the vacuum and PANEL is attached stably by vacuum.

    ◆X-Y-Θ can be adjusted manually. After alignment is ok, then press the start button.

    ◆The left platform moves to the under of the pressure head, then bonding start.

    ◆Right platform move to the middle of the device, then the product pre-alignment

    ◆X-Y-θ can be manually adjusted by CCD,  after alignment is ok, press start button.

    ◆The right platform moves to the under of the pressure head, then bonding start.

    ◆left platform move to the middle of the device and repeat above action

    84ac926b92516b4adcf446f75a8eb81.png


    8187d037d2f2bd6ae05b126b5c2df78.png

    2c197f7aed9e3fe186e575ffd57f526.png